In general, fixed-wing aircraft have the advantages of good endurance, high stability and heavy load, while single-rotor aircraft have the advantages of heavy load, strong mobility and can take off and land immediately at fixed points, the multi-rotor aircraft has become the representative of UAV because of its advantages such as open flight control source code, good flight balance, easy operation and good quality of dynamic video photography. The world's leading manufacturers of consumer drones, such as continental innovation and technology (Dji) , Parrot of France and 3DRobotics of the United States, as well as Gopro, an American sports camera brand, are expected to launch drones in 2016, and a few days ago announced that customers can accept orders of electronic oem and Pegatron, are multi-rotor aircraft-based products. Ofweek industrial control: List of semiconductor materials is expected to break through! Taiwan yesterday (3) announced that multinational teams from Taiwan, Japan and the Saudi Arabia have developed a single-layer P-N interface that is expected to replace silicon wafers as the core component of the new generation of semiconductors, widely used in wearable devices and mobile phones. The results, which are the first to be published in the world, will not only be published in the latest issue of the international journal Science, but are expected to attract more collaborative research from TSMC, the List of semiconductor materials team said, in order to seize the global market business opportunities. A major breakthrough in the List of semiconductor materials bottleneck has been made in support of the technology budget for the "cutting-edge Crystal Material Development and Fabrication Project" . Zhang Wenhao, a professor in the Department of Electronic Physics at Jiaotong University, the host of the Taiwan Research Team's project, pointed out that both Intel and Samsung are actively engaged in the research of monolayer materials, and TSMC is also actively engaged in cooperation with the academic community, in the future, whoever can develop the single-layer component materials first will be able to occupy a place in the global market. The Molybdenum disulfide is a material that scientists around the world believe has potential for a new generation of semiconductors, he said. This time, the research team has developed a perfect P-N interface for a single layer of Molybdenum disulfide and a single layer of tungsten diselenide, the invention is expected to solve the key problems in the preparation of semiconductor elements. In the future, he said, it could be widely used in ultra-micro electronic component, especially for the ultra-thin and transparent single-layer Molybdenum disulfide, which has the potential to be used in low-energy soft electronics and wearable electronic component in the future, or an APP. Li Lianzhong, a Taiwanese scientist who used to work for the Hung En Liu and was recruited by the king's University of Science and technology of Saudi Arabia as a scientist in Saudi Arabia, organized multinational cooperation teams from Taiwan, Saudi Arabia and Japan to carry out large-scale cooperation projects, he said. In addition to Zhang Wenhao Taiwan research team, there are also professor of the Department of Materials Wei Guanghua, academia SINICA research center of Zhu Zhiwei and others. Molybdenum disulfide is a lamellar material after graphene, with a single layer of Molybdenum disulfide having excellent luminous efficiency, Electron mobility (fast reaction) and high switching ratio (more stable transistors) , it can be used in new low-energy logic circuits in the future, and it is very possible to replace the current silicon as the main core component of the next generation. The international semiconductor industry, such as Intel, TSMC and Samsung, has a minimum component technology of about 7 to 10 nanometers, and the research results are molybdenum disulfide and related Inorganic 2D materials electronics research and applications, he said, molybdenum disulfide will assist in the application of materials in 2 NM Semiconductor Fabrication Technology.
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